首页> 外国专利> FORMATION OF OHMIC CONTACTS FOR A DEVICE PROVIDED WITH A REGION MADE OF III-V MATERIAL AND A REGION MADE OF ANOTHER SEMICONDUCTOR MATERIAL

FORMATION OF OHMIC CONTACTS FOR A DEVICE PROVIDED WITH A REGION MADE OF III-V MATERIAL AND A REGION MADE OF ANOTHER SEMICONDUCTOR MATERIAL

机译:由III-V材料制成的区域和另一种半导体材料制成的区域的设备的欧姆接触的形成

摘要

A production of contact zones for a transistor device including the steps of:a) forming at least one layer made of a compound based on semiconductor and metal on one or more first semiconductor region(s) of a first N-type transistor and on one or more second semiconductor region(s) of a second P-type transistor resting on a same substrate, the first regions being based on a III-V type material whereas the second semiconductor regions are based on another material different from the III-V material,the semiconductor of the compound being an N-type dopant of the III-V material,b) carrying out at least one thermal annealing so as to form on the first semiconductor regions first contact zones and on the second semiconductor regions second contact zones based on a semiconductor and metal compound while increasing the N-doping of the III-V material.
机译:用于晶体管器件的接触区的生产,包括以下步骤: a)在第一N型晶体管的一个或多个第一半导体区域和一个或多个第二半导体区域上形成至少一层由基于半导体和金属的化合物制成的层置于同一基板上的第二P型晶体管的结构,第一区域基于III-V型材料,而第二半导体区域基于不同于III-V材料的另一种材料, 该化合物的半导体是III-V材料的N型掺杂物, b )进行至少一个热退火,以基于半导体和金属化合物w在第一半导体区域上形成第一接触区,在第二半导体区域上形成第二接触区在增加III-V材料的N掺杂的同时。

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