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Systems and methods for improving deposition rate uniformity and reducing defects in substrate processing systems

机译:用于提高沉积速率均匀性并减少衬底处理系统中的缺陷的系统和方法

摘要

Systems and methods for delivering liquid precursor in a substrate processing system include supplying liquid precursor using a first valve in fluid communication with a liquid precursor source; supplying purge gas using a second valve in fluid communication with a purge gas source; arranging a third valve having a first input port in fluid communication with an output port of the first valve and a second input port in fluid communication with an output port of the second valve; arranging an input port of a first divert injector valve in fluid communication with an output port of the third valve; and operating the first valve, the second valve, the third valve and the first divert injector valve in first, second, third and fourth modes.
机译:用于在基板处理系统中输送液体前驱物的系统和方法包括:使用与液体前驱物源流体连通的第一阀来供应液体前驱物;以及利用第一阀供应液体前驱物。使用与净化气体源流体连通的第二阀供应净化气体;布置第三阀,该第三阀具有与第一阀的输出端口流体连通的第一输入端口和与第二阀的输出端口流体连通的第二输入端口;第一分流喷射器阀的输入端口与第三阀的输出端口流体连通;并且以第一,第二,第三和第四模式操作第一阀,第二阀,第三阀和第一分流喷射阀。

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