Integrated MEMS-CMOS devices and methods for fabricating MEMS devices and CMOS devices

摘要

Integrated MEMS-CMOS device and method manufacture MEMS device and CMOS device are provided. Illustrative methods include the semiconductor substrate to form CMOS device and/or the first upper side for manufacturing the CMOS device of MEMS device. In addition,This method includes forming MEMS device and/or the semiconductor substrate in second side. In second side of semiconductor substrate semiconductor substrate opposite with the first side.