Chip-on-film (COF) package, COF package array including the same, and display device including the same

摘要

A chip-on-film (COF) package includes a base film, an integrated circuit chip, and a plurality of signal interconnections. The base film includes a bonding region and a non-bonding region. The integrated circuit chip is at the non-bonding region. Each of the plurality of signal interconnections is coupled to the integrated circuit chip and extend to the bonding region along a first direction. The plurality of signal interconnections are spaced from each other along a second direction substantially crossing the first direction. The plurality of signal interconnections alternate on a first surface and a second surface opposite to the first surface of the base film along the second direction.