首页> 外国专利> Method of making a semiconductor device having a semiconductor material on a relaxed semiconductor including replacing a strained, selective etchable material, with a low density dielectric in a cavity

Method of making a semiconductor device having a semiconductor material on a relaxed semiconductor including replacing a strained, selective etchable material, with a low density dielectric in a cavity

机译:在松弛的半导体上制造具有半导体材料的半导体器件的方法,包括用空腔中的低密度电介质代替应变的,可选择性蚀刻的材料

摘要

A semiconductor device comprising a substrate having a region protruding from the substrate surface; a relaxed semiconductor disposed on the region; an additional semiconductor disposed on the relaxed semiconductor; and low density dielectric disposed next to and at least partially underneath the relaxed semiconductor and adjacent to the protruding region of the substrate.
机译:一种半导体器件,包括:衬底,具有从衬底表面突出的区域;布置在该区域上的松弛半导体;布置在松弛半导体上的附加半导体;低密度电介质设置在松弛半导体的附近并至少部分在松弛半导体的下方,并邻近基板的突出区域。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号