LED flip chip structure and method of forming a LED flip chip structure

摘要

LED Flip Chip Structure and Method of Forming a LED Flip Chip Structure A LED (LED) structure has semiconductor layers, which include a p-type layer, an active layer and a layer of type n. the p-type layer has a lower surface and the n-type layer has an upper surface through which light is emitted. Parts of the p-type layer and the active layer are then corroded to expose the n-type layer. The led surface is standardized with a photoresist and copper is coated over exposed surfaces to form p and n electrodes in electrical contact with their corresponding semiconductor layers. There is a gap between the n and p electrodes. To provide mechanical support of the semiconductor layers between space, a dielectric layer is formed in space followed by filling the space with metal. The metal is standardized to form pins that substantially cover the bottom surface of the led mold, but do not come into contact with the electrodes. the substantially uniform coverage sustains the semiconductor layer during subsequent process steps. 1/1