Multi-lead surface mount for BGA packages

摘要

wielowyprowadzeniowa coaster under systems in a modular assembly type bga to plate - plate consists of a multilayered printed circuit board (1) with many fields installation (2) under wielowyprowadzeniowy system in bga housing with electrical connections (3) and terminals (4) designed in the form of open holes przelotowych metallized on their internal surfaces (5),which are set on the shaped in the form meandru edges (6) printed circuit board (1).