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VAPOR DEPOSITION DEPOSITED PHOTORESIST, AND MANUFACTURING AND LITHOGRAPHY SYSTEMS THEREFOR

机译:气相沉积的光致抗蚀剂,及其制造和光刻系统

摘要

A photoresist vapor deposition system includes: a vacuum chamber having a heating element and cooled chuck for holding a substrate, the vacuum chamber having a heated inlet; and a vapor deposition system connected to the heated inlet for volatilizing a precursor into the vacuum chamber for condensing a photoresist over the substrate cooled by the cooled chuck. The deposition system creates a semiconductor wafer system that includes: a semiconductor wafer; and a vapor deposited photoresist over the semiconductor wafer. An extreme ultraviolet lithography system requiring the semiconductor wafer system includes: an extreme ultraviolet light source; a mirror for directing light from the extreme ultraviolet light source; a reticle stage for imaging the light from the extreme ultraviolet light source; and a wafer stage for placing a semiconductor wafer with a vapor deposited photoresist.
机译:一种光致抗蚀剂气相沉积系统,包括:真空室,其具有加热元件和用于保持基板的冷却卡盘,所述真空室具有加热的入口;气相沉积系统,其连接到加热的入口,用于使前体挥发到真空室中,以在通过冷却的卡盘冷却的基板上冷凝光致抗蚀剂。该沉积系统产生半导体晶片系统,该半导体晶片系统包括:半导体晶片;以及半导体。气相沉积的光致抗蚀剂在半导体晶片上。要求半导体晶片系统的极紫外光刻系统包括:极紫外光源;和用于引导来自极紫外光源的光的镜子;掩模版台,用于成像来自极紫外光源的光;晶片台,用于放置具有气相沉积的光致抗蚀剂的半导体晶片。

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