Film, device and method adhesive to assess the structural integrity of glued joints

摘要

Film, device and method adhesive to evaluate the structural integrity of joints glued by means of the adhesive. The device comprises a film-type adhesive containing at least 0.1% by weight of carbon nanoparticles with respect to the adhesive incorporated by means of inkjet or mask printing techniques; two electrical contacts (2) in electrical connection with the film adhesive (1), means (3) for measuring the electrical resistance between the electrical contacts and a control unit (4) configured to receive and analyze the variation of the resistance measurements electrical and, based on said variation, evaluate the structural integrity of the adhesive. The method comprises: measuring the electrical resistance between two electrical contacts (2) in electrical connection with the adhesive (1); analyze the variation of the electrical resistance measurements and, based on said variation, evaluate the structural integrity of the adhesive (1).