Adhesive film, device and method for evaluating the structural integrity of bonded together, and method of making the adhesive film

摘要

Adhesive film, device and method for evaluating the structural integrity of bonded together, and method of making the adhesive film. The device comprises an adhesive film (1) containing 0.1-8% by weight of carbon nanoparticles with respect to the adhesive film; two electrical contacts (2) in electrical connection with the adhesive film (1), means (3) for measuring the electrical resistance between the electrical contacts and a control unit (4) configured to receive and analyze measurement variation of electrical resistance and, based on such variation, evaluate the structural integrity of the adhesive film. The method for manufacturing the adhesive film (1) comprises incorporating into an adhesive film, using a mask technique or printing inkjet a 0.1-8% by weight of carbon nanoparticles relative to adhesive movie.