The present disclosure is directed to polymer composites, and, particularly, thermally conductive polymer composites. The polymer composites can include from about 20 wt.% to about 80 wt.% of a base polymer resin; from about 1 wt.% to about 70 wt.% of thermoconductive filler material comprising thermoconductive particles having a plurality of electronegative functional groups at the surface of the particles, and having a thermal conductivity of at least 2 W/m*K; from about 0.01 wt.% to about 20 wt.% of an amphiphilic compatibilizer including a hydrophilic component and hydrophobic chain component; and, optionally, from about 0 wt.% to 50 wt.% of an additive. As compared to a control composition having 0.00 wt.% of the amphiphilic compatibilizer, the composite has (i) increased mechanical strength as measured by Izod impact testing, and, (ii) increased thermal conductivity as measured by through-plane or in-plane testing.
展开▼
机译：本公开涉及聚合物复合材料，尤其是导热聚合物复合材料。所述聚合物复合材料可包含约20重量％至约80重量％的基础聚合物树脂;优选地，所述聚合物复合物可包含约80重量％的基础聚合物树脂。约1重量％至约70重量％的导热填充材料，所述导热填充材料包括在所述颗粒的表面上具有多个负电性官能团且导热率至少为2W / m * K的导热颗粒;约0.01重量％至约20重量％的两亲性增容剂，包括亲水性组分和疏水性链组分;任选地，添加剂的量为约0重量％至50重量％。与具有0.00重量％的两亲性增容剂的对照组合物相比，该复合材料具有（i）通过艾佐德冲击试验测量的机械强度，和（ii）通过直通面或面内测量的热导率测试。
展开▼
