HIGH THERMAL CONDUCTIVITY COMPOSITE INTERFACE MATERIAL AND PREPARATION METHOD THEREFOR

摘要

Provided is a high thermal conductivity composite interface material, comprising an organosilicon polymer, a thermal conductivity powder and an adjuvant, wherein the thermal conductivity powder comprises a spherical thermal conductivity powder and a polyhedral thermal conductivity powder, and wherein the ratio in parts by weight of the organosilicon polymer, the spherical thermal conductivity powder, the polyhedral thermal conductivity powder and the adjuvant is as follows: 5-10 of the organosilicon polymer, 75-90 of the spherical thermal conductivity powder, 1-5 of the polyhedral thermal conductivity powder, and 0.5-1 of the adjuvant. Also provided is a method for preparing a polyhedral high thermal conductivity composite interface material. The high thermal conductivity composite interface material is prepared by mixing and calendering an organosilicon polymer, a thermal conductivity powder and an adjuvant, wherein the thermal conductivity powder comprises a spherical thermal conductivity powder and a polyhedral thermal conductivity powder. By utilizing the polyhedral thermal conductivity powder to increase the contact surfaces of various materials, thereby increasing thermal conductivity channels, the thermal conductivity of the high thermal conductivity composite interface material prepared is up to 5.0-7.2 W/m•K.