METAL FOIL, METAL FOIL PROVIDED WITH RELEASE LAYER, LAMINATE BODY, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD

摘要

According to the present invention, when a metal foil has been provided with a release layer and then stuck onto a resin substrate, the resin substrate can be physically peeled away, and, as a result, during a process wherein the metal foil is removed from the resin substrate, the metal foil can be removed at a favorable cost without the profile that has been transferred onto the surface of the resin substrate from the surface of the metal foil being damaged. Also according to the present invention, as a result of a metal foil that has been peeled away and removed from a resin substrate being stuck onto another resin substrate, the transfer pattern on the surface of the metal foil can be transferred onto the surface of resin substrates multiple times or continuously/repetitively, which makes it possible to manufacture printed circuit boards at a favorable production cost. A metal foil that can repeatedly undergo a process wherein the metal foil is stuck onto a resin substrate and then physically peeled away.