KELVIN TEST PROBE, KELVIN TEST PROBE MODULE, AND MANUFACTURING METHOD THEREFOR

摘要

The present invention relates to a Kelvin test probe, a Kelvin test probe module, and a manufacturing method therefor. The Kelvin test probe according to the present invention comprises: an upper insulating sheet made of a ductile material; a lower insulating sheet made of a ductile material and spaced apart from the upper insulating sheet in the vertical direction; an insulating elastic member made of an elastic material and connecting the upper insulating sheet and the lower insulating sheet; a first upper conductive pad formed on the surface of one side of the upper insulating sheet; a second upper conductive pad formed on the surface of the other side of the upper insulating sheet; a first upper conductive pin attached to the first upper conductive pad such that one end thereof protrudes upward from the upper insulating sheet; a second upper conductive pin attached to the second upper conductive pad such that one end thereof protrudes upward from the upper insulating sheet; a first lower conductive pad formed on the surface of one side of the lower insulating sheet; a second lower conductive pad formed on the surface of the other side of the lower insulating sheet; a first lower conductive pin attached to the first lower conductive pad such that one end thereof protrudes downward from the lower insulating sheet; a second lower conductive pin attached to the second lower conductive pad such that one end thereof protrudes downward from the lower insulating sheet; a first conductive wire for electrically connecting the first upper conductive pad and the first lower conductive pad such that the first upper conductive pin, the first upper conductive pad, the first lower conductive pad, and the first lower conductive pin form a first conductive line in the vertical direction; and a second conductive wire for electrically connecting the second upper conductive pad and the second lower conductive pad such that the second upper conductive pin, the second upper conductive pad, the second lower conductive pad, and the second lower conductive pin form a second conductive line in the vertical direction.