HEAT DISSIPATION DEVICE OF HEATING DEVICE, MOBILE TERMINAL AND HEAT RADIATION ASSEMBLY OFPOWER AMPLIFIER

摘要

A heat dissipation device of a heating device, mobile terminal and heat radiation assembly ofa power amplifier (1), the heat radiation assembly ofthepower amplifier (1) comprising a PCB (10), a plurality of power amplifiers (20) and a heat-conducting plate (30), the plurality of power amplifiers (20) being distributed on a first surface (11) and a second surface (12) of the PCB (10); the heat-conducting plate (30) is disposed on the PCB (10) to absorb heat, thereby dissipating heat to the plurality of power amplifiers (20). The plurality of power amplifiers have a centralized layout, and have a simple structure and a good heat dissipation effect, improving PCB density and reducing a size of the PCB and supporting product miniaturization.