THREE DIMENSIONAL FULLY MOLDED POWER ELECTRONICS MODULE FOR HIGH POWER APPLICATIONS AND THE METHOD THEREOF

摘要

A power electronic package (100) includes a first substrate (110), a second substrate (120) oppositely disposed from the first substrate, one or more chips (130) disposed between the substrates, and at least three spacers (140). The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks (150) that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.