FPCB MANUFACTURING METHOD OF DOUBLE LAYER FLEXIBLE PRINTED CIRCUIT BOARD USING PINNACLE MOLD

摘要

A copper foil is selectively removed by a physical method using a pinnacle mold instead of etching the copper foil by a chemical method using an etchant, so that the use of a chemical such as an etchant can be basically eliminated. Therefore, the occurrence of environmental pollution can be minimized. Also, a multi-layer circuit of both sides can be realized by using a roll-to-roll method of automation type rather a manual type. So, labor cost and manufacturing cost can be drastically reduced.