FPCB MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD USING PINNACLE MOLD

摘要

Disclosed is a method for manufacturing a circuit pattern for an FPCB using a pinnacle mold which can have a smooth process surface, and can realize a fine pitch as well since a circuit pattern is formed by a physical method using a pinnacle mold. The method for manufacturing a circuit pattern for an FPCB comprises the steps of: preparing a carrier-liner laminated product in which a part of a silicon adhesive film arranged in a circuit pattern forming area is exposed; primarily cutting a copper foil arranged in the circuit pattern forming area with a pinnacle outer blade mold; secondarily cutting the copper foil arranged in the circuit pattern forming area with a pinnacle inner blade mold; attaching the copper foil arranged in the circuit pattern forming area to the silicon adhesive film; and forming a circuit pattern in the circuit pattern forming area.