CMOS MEMS INTEGRATED CMOS AND MEMS SENSOR FABRICATION METHOD AND STRUCTURE

摘要

A method of providing a CMOS-MEMS structure is disclosed. The method includes patterning a first upper metal on a MEMS operating substrate and a second upper metal on a CMOS substrate. Each of the MEMS operating substrate and the CMOS substrate includes an oxide layer thereon. The method includes depositing a respective oxide layer on the MEMS operating substrate and the base substrate using a first bonding step of bonding the first patterned upper metal of the MEMS actuator substrate to the second patterned upper metal of the base substrate And etching. Finally, the method includes using a second bonding step to etch the active layer into the MEMS actuation substrate and to bond the MEMS actuation substrate to the MEMS handle substrate.