ENCAPSULANT FOR LED PACKAGE AND LED PACKAGE MANUFACTURING METHOD USING SAME

摘要

The present invention relates to an encapsulant for an LED package and an LED package manufacturing method using the same. Provided is the encapsulant for an LED package which includes 45 to 55 wt% of transparent powder, 0.1 to 10 wt% of a binder, and 35 to 45 wt% of a solvent. The light output of the LED package can be improved by blocking a contact between external air and ultraviolet rays generated in an LED chip by spraying the encapsulant on a lead frame mounting the LED chip and hardening the encapsulant by emitting a xenon light source.;COPYRIGHT KIPO 2017