- Method for manufacturing fan-out wafer level package using metal core solder ball in interconnector for PoP

摘要

A fan-out wafer ready package manufacturing method of the present invention includes the steps of preparing a silicon sacrificial substrate, forming a sacrificial pad directly on the sacrificial substrate, mounting a metal core solder ball interconnector on the sacrificial pad, A step of mounting a semiconductor chip on which a contact metal is formed on a sacrificial substrate in face-up form, molding the protective member on the sacrificial substrate, grinding a part of the upper surface of the sacrificial substrate, First planarizing until the contact metal is exposed, forming a re-wiring layer on the exposed contact metal and the interconnector, and secondly planarizing to remove at least the sacrificial substrate. According to the structure of the present invention as described above, the thickness of the package can be freely adjusted.