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VIA PATTERNING USING MULTIPLE PHOTO MULTIPLE ETCH
VIA PATTERNING USING MULTIPLE PHOTO MULTIPLE ETCH
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机译:通过使用多张照片多张照片进行拼版
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摘要
The method includes forming a dielectric layer, forming a photoresist over the dielectric layer, forming a first mask layer over the photoresist, and forming a second mask layer over the first mask layer . First-photo-first-etching is performed to form a first via pattern in the second mask layer, and the first-photo-first-etching stops on the upper surface of the first mask layer. Second-photo-second-etching is performed to form a second via pattern in the second mask layer, and the second-photo-second-etching stops on the upper surface of the first mask layer. The first mask layer is etched using the second mask layer as an etching mask. The photoresist and dielectric layer are etched to simultaneously transfer the first via pattern and the second via pattern into the dielectric layer.
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