ALN PVD MCA ESCGAS COOLED MINIMAL CONTACT AREAMCA ELECTROSTATIC CHUCKESC FOR ALUMINUM NITRIDEALN PVD PROCESS

摘要

Embodiments of the present disclosure include an electrostatic chuck assembly, a processing chamber, and a method of maintaining the temperature of the substrate. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate, and a gas box. The cooling plate includes a gas channel formed in the cooling plate. The gas box is operable to control the flow of cooling gas through the gas channel.