COPPER FOIL, COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, COPPER FOIL WITH CARRIER, COPPER FOIL WITH CARRIER FOR HIGH-FREQUENCY CIRCUIT, LAMINATE, METHOD TO MANUFACTURE PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

The present invention relates to a copper foil, favorably restraining a transmission loss even if the copper foil is used for a high-frequency circuit board, and having excellent adhesion with a resin. The copper foil having a roughening treatment layer having a primary particle layer of which surface roughness (Ra) of a surface is not greater than or equal to 0.12 m, and a primary particle with an average size of 0.10-0.25 m.;COPYRIGHT KIPO 2017