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METHOD FOR MANUFACTURING SEMICONDUCTOR HEAT RADIATION PLATE WITH IMPROVED ABRASION RESISTANT AND ELECTRICAL PROPERTY AND SEMICONDUCTOR HEAT RADIATION PLATE THEREBY
METHOD FOR MANUFACTURING SEMICONDUCTOR HEAT RADIATION PLATE WITH IMPROVED ABRASION RESISTANT AND ELECTRICAL PROPERTY AND SEMICONDUCTOR HEAT RADIATION PLATE THEREBY
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机译:制备具有改善的耐磨性和电性能的半导体散热板的方法以及由此制造的半导体散热板
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摘要
The present invention relates to a method for manufacturing a semiconductor heat radiation plate having improved wear resistance and electrical characteristics and, more particularly, to a method for manufacturing a semiconductor heat radiation plate with improved wear resistance, electrical resistance and contact resistance. In addition, the manufacturing method of the semiconductor heat radiation plate performs scrubbing on a surface of a copper plate serving as a base substrate of the semiconductor heat radiation plate and increases the hardness of a plating layer, so that the semiconductor heat radiation plate has excellent electrical and contact resistance and thus exhibits improved wear resistance and electrical characteristics. In addition, according to the present invention, the manufacturing method of the semiconductor heat radiation plate smoothly performs a laser marking operation on the surface of the heat radiation plate, sharpens the laser marked part, and prevents discoloration.;COPYRIGHT KIPO 2017
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