首页> 外国专利> METHOD FOR MANUFACTURING SEMICONDUCTOR HEAT RADIATION PLATE WITH IMPROVED ABRASION RESISTANT AND ELECTRICAL PROPERTY AND SEMICONDUCTOR HEAT RADIATION PLATE THEREBY

METHOD FOR MANUFACTURING SEMICONDUCTOR HEAT RADIATION PLATE WITH IMPROVED ABRASION RESISTANT AND ELECTRICAL PROPERTY AND SEMICONDUCTOR HEAT RADIATION PLATE THEREBY

机译:制备具有改善的耐磨性和电性能的半导体散热板的方法以及由此制造的半导体散热板

摘要

The present invention relates to a method for manufacturing a semiconductor heat radiation plate having improved wear resistance and electrical characteristics and, more particularly, to a method for manufacturing a semiconductor heat radiation plate with improved wear resistance, electrical resistance and contact resistance. In addition, the manufacturing method of the semiconductor heat radiation plate performs scrubbing on a surface of a copper plate serving as a base substrate of the semiconductor heat radiation plate and increases the hardness of a plating layer, so that the semiconductor heat radiation plate has excellent electrical and contact resistance and thus exhibits improved wear resistance and electrical characteristics. In addition, according to the present invention, the manufacturing method of the semiconductor heat radiation plate smoothly performs a laser marking operation on the surface of the heat radiation plate, sharpens the laser marked part, and prevents discoloration.;COPYRIGHT KIPO 2017
机译:本发明涉及一种具有改善的耐磨性和电特性的半导体散热板的制造方法,更具体地,涉及一种具有改善的耐磨性,电阻和接触电阻的半导体散热板的制造方法。另外,半导体散热板的制造方法在用作半导体散热板的基础基板的铜板的表面上进行擦洗,并且增加了镀层的硬度,从而使得半导体散热板具有优异的性能。电气和接触电阻,因此具有改善的耐磨性和电气特性。另外,根据本发明,半导体散热板的制造方法在散热板的表面上平滑地进行激光打标操作,使激光打标的部分变尖并且防止变色。; COPYRIGHT KIPO 2017

著录项

  • 公开/公告号KR101727282B1

    专利类型

  • 公开/公告日2017-04-26

    原文格式PDF

  • 申请/专利权人 KONYANG TECH CO. LTD.;

    申请/专利号KR20160111004

  • 发明设计人 CHOI JE SOONKR;

    申请日2016-08-30

  • 分类号H01L23/373;H01L23;H05K7/20;

  • 国家 KR

  • 入库时间 2022-08-21 13:25:40

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