- PRINTING SEMICONDUCTOR ELEMENTS BY SHEAR-ASSISTED ELASTOMERIC STAMP TRANSFER

摘要

A method and apparatus for transfer printing of semiconductor devices on a receiving substrate are provided. In one aspect, the printing is in conformal contact between the elastomeric stamp painted with the ink in the semiconductor element and the receiving substrate, and during stamp removal, a shear offset is applied between the stamp and the receiving substrate. The shear-offset printing process achieves high printing transfer gain with good batch precision. Processing parameter selection during transfer printing, including stamp-backing pressure application and time varying vertical displacement, results in a sufficiently constant delamination rate with subsequent transfer printing improvements.