- Non-cyanide Cu-Sn Alloy Plating Solution

摘要

The present invention relates to a non-cyanide copper-tin alloy electroplating solution, which comprises (A) a copper salt supplying a copper ion and a tin salt supplying a tin ion, (B) a conductive salt, (C) a tetrahydroxypropyl a second complexing agent using 50-70 g / L of ethylenediamine and a second complexing agent using 5-15 g / L of 2,2 ', 2'-nitrilotriethanol Tris (2-hydroxyethyl) amine, (D) And a composition of a brightener. According to the present invention, 1-2 g / L of 1,2-dihydroxybenzene is used as the antioxidant and 1-2 ml / L of 1-formylnaphthalene is used as a polishing agent. Accordingly, the present invention can provide a plating solution which does not contain any nickel and does not cause allergic reaction due to human contact due to the substitution of copper alloy material and other metallic nickel plating, A copper-tin alloy plating liquid having a uniform alloy composition even in long-term use in continuous plating operation can be obtained, and a copper-tin alloy exhibiting a nickel-chromatic appearance at the time of mass production can be obtained, and stable quality and productivity can be obtained There is an effect that can be realized.