首页> 外文期刊>Transactions of the Institute of Metal Finishing: The International Journal for Surface Engineering and Coatings >Use of response surface methodology for evaluation of effective parameters in codeposition of Cu-Sn alloys using non-cyanide electroplating solution
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Use of response surface methodology for evaluation of effective parameters in codeposition of Cu-Sn alloys using non-cyanide electroplating solution

机译:使用响应面方法评估使用非氰化物电镀液的Cu-Sn合金共沉积中的有效参数

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摘要

A pyrophosphate based solution, as an acidic electrolyte, was developed for bronze electroplating. By using a statistical experimental design, response surface method, the effects of five factors [copper concentration (Cu), tin concentration (Sn), pyrophosphate concentration (P), current density j and pH] on the composition of the electroplated alloy as well as the process efficiency were evaluated. Statistical analysis indicated that all the parameters were significant and a second order polynomial model was successfully fitted to the data for both the alloy composition and the process efficiency. Based on the results obtained, a solution of Cu(II)=8·04 g L~(-1), Sn(II)=26·36 g L~(-1), P=113·22 g L~(-1) at pH=3·14 and j=10 mA cm~(-2) was introduced as the best electroplating solution in terms of process efficiency.
机译:开发了一种作为酸性电解质的焦磷酸盐基溶液,用于青铜电镀。通过使用统计实验设计,响应面法,五个因素[铜浓度(Cu),锡浓度(Sn),焦磷酸盐浓度(P),电流密度j和pH]对电镀合金的成分也有影响评估过程效率。统计分析表明,所有参数都很重要,并且针对合金成分和工艺效率的数据成功地拟合了二阶多项式模型。根据得到的结果,Cu(II)= 8·04 g L〜(-1),Sn(II)= 26·36 g L〜(-1),P = 113·22 g L〜(就工艺效率而言,在pH = 3·14且j = 10 mA cm-1(-1)的情况下,作为最佳电镀液被引入。

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