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Non-cyanide gold-palladium alloy plating solution and plating method

机译:非氰化物金钯合金电镀液及电镀方法

摘要

PROBLEM TO BE SOLVED: To provide a non-cyanogen system gold-palladium alloy plating solution that can make the appearance of a plating film excellent and can reliably suppress generation of defects such as a crack to the plating film.SOLUTION: The present invention relates to a non-cyanogen system gold-palladium alloy plating solution containing gold salt, palladium salt and appearance modifier, and is characterized in that the solution contains phosphate as appearance modifier and one or more of tellurium and/or selenium. It is preferred that the solution further contains hydantoin-type compound.
机译:解决的问题:提供一种非氰系金-钯合金镀覆溶液,其可以使镀膜的外观优异并且可以可靠地抑制诸如镀膜的裂纹等缺陷的产生。含有金盐,钯盐和外观改性剂的非氰基体系金-钯合金镀液,其特征在于,该溶液含有磷酸盐作为外观改性剂和一种或多种碲和/或硒。优选溶液中还含有乙内酰脲类化合物。

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