METHOD OF ELECTRONIC MODULES THERMAL PROTECTION

摘要

FIELD: electronics.;SUBSTANCE: invention relates to microelectronic equipment protection against external destructive factors, such as long-term high-temperature effects. Achieved by fact, that heat absorption is carried out by means of heat protection composition and structure, consisting of two types of composite mixture: first type is highly porous material (85–90 % of open pores) with powder-fibrous structure based on amorphous silica in form of fine particles and nano-fibres. Then above mentioned mixture is pressed into prefabricated tooling. Second type of composite mixture is obtained by mixing of fine polymer material and mineral filler. External layer used with respect to protected module is arranged first type of composite mixture, which is heat flow barrier, and inner heat-absorbing layer is second type of composite mixture, inside of which protected object is arranged, both type of pressed composite mixtures are in direct contact, virtually without air space between them.;EFFECT: technical result is development of efficient heat-absorbing method of electronic module heat by increase of thermal protection specific heat-absorbing capacity.;1 cl