METHOD AND DEVICE FOR THERMAL PROTECTION Electronic modules

摘要

1. A method for thermal protection of electronic modules by extracting heat from the device via heat shielding mixture, characterized in that the heat protective mixture is a mixture of nickel and orthophosphate crystals of barium citrate in a weight ratio of from 20:80 to 80:20 with the gel of silicic acid, silicate aluminum and sodium citrate, and orthophosphate crystals of nickel and barium citrate coated pre abietates of iron, the saturated sodium silicate gel and iron acetate and nickel orthophosphate crystals in a coating of iron abietates arranged around the crystals of barium citrate in their own shell of abietate zheleza.2. An apparatus for performing the method of thermal protection of electronic modules comprising a housing, the inner surfaces of which form a cavity for receiving in its center of electronic modules, a thermal gasket adjacent the inner surface of the housing, and special means for removing gaseous products, characterized in that the space between the electronic modules and thermal pad filled with a mixture of nickel and orthophosphate crystals of barium citrate gel silicic acid, aluminum silicate, and sodium citrate, and orthophosphate crystals of nickel and barium citrate coated pre abietates of iron, the saturated sodium silicate gel and ferric acetate, and the crystals orthophosphate nickel abietate sheathed iron disposed around barium citrate crystals in their own shell of abietate iron.