首页> 外国专利> METHOD OF PLASMA-STIMULATED ATOMIC-LAYER DEPOSITION OF INSULATING DIELECTRIC COATINGS ON HETEROSTRUCTURES OF NITRID-GALLIUM SEMICONDUCTOR DEVICES

METHOD OF PLASMA-STIMULATED ATOMIC-LAYER DEPOSITION OF INSULATING DIELECTRIC COATINGS ON HETEROSTRUCTURES OF NITRID-GALLIUM SEMICONDUCTOR DEVICES

机译:氮化镓半导体器件异质结构上电介质涂层的等离子体激发原子层沉积方法

摘要

FIELD: technological processes.;SUBSTANCE: surface of heterostructure is pretreated in an inductively coupled low-pressure hydrogen plasma with a reduced power input in the discharge zone away from a plasma source, in which low concentration of ions is provided, no more than 109 cm-3 and simultaneously a high concentration of chemically active radicals, at least 1013cm-3 stimulating surface reactions of passivation of broken chemical bonds and removal of natural oxide adsorbed from the atmosphere of moisture and other surface adsorbates to ensure subsequent atomic-layer growth of the film on the surface with a minimum amount of surface states at the film-substrate interface.;EFFECT: improving the electrical and frequency characteristics of nitride-gallium semiconductor devices.;3 cl
机译:领域:工艺过程;物质:异质结构的表面在感应耦合低压氢等离子体中进行预处理,该等离子体在离等离子体源较远的放电区域中以降低的功率输入,在该等离子体中提供的离子浓度低,不超过10 9 cm -3 以及高浓度的化学活性基团,至少刺激10 13 cm -3 断裂的化学键的钝化和从湿气和其他表面吸附物中除去的天然氧化物的表面反应,以确保膜在表面上随后的原子层生长,并在膜-基底界面处具有最小量的表面状态。效果:改善氮化镓半导体器件的电气和频率特性。; 3 cl

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