Method for producing nanostructures in micromechanical components and micromechanical component

摘要

The invention provides a method for producing nanostructures in micromechanical components as well as a micromechanical component. Here, the method comprises the steps of providing a semiconductor substrate. On the semiconductor substrate, a catalytic material is deposited and patterned. On the catalytic material, a sacrificial material is applied and patterned. Thereafter, a bonding material is deposited and patterned on the semiconductor substrate and on the sacrificial material. By subsequently removing the sacrificial material, etch accesses are formed between the contacting material and the catalytic material. Subsequently, etching trenches are formed between and underneath the bonding material by means of the catalytic material, whereby vertical semiconductor nanostructures which can be contacted electrically on both sides are formed.