Automatic assembly system and automatic assembly process to increase the yield in the automatic assembly of printed circuit boards

摘要

In an automatic mounting system, a component mounting cell has a solder attaching unit that solder an electronic component to the circuit board, and a board information acquisition unit that has board information containing at least one of positional information of an alignment mark located at a specific location of the board, attachment position information of the electronic board Component on the circuit board, and a curvature information of the printed circuit board comprises, obtained, a manufacturing control device has a correction data generating unit that generates correction data for correcting a program executed by the subsequent process cell on the basis of the board information, and a subsequent process cell has a subsequent process execution unit that determines the subsequent process based on the correction data generated by the correction data generation unit performs on.