首页> 外国专利> FLAKE-LIKE SILVER POWDER, CONDUCTIVE PASTE, AND METHOD FOR PRODUCING FLAKE-LIKE SILVER POWDER

FLAKE-LIKE SILVER POWDER, CONDUCTIVE PASTE, AND METHOD FOR PRODUCING FLAKE-LIKE SILVER POWDER

机译:片状银粉,导电性糊剂和生产片状银粉的方法

摘要

Provided are a flaky-like silver powder having a low bulk density as well as a predetermined average particle size (D 50 ) and the like, which is obtainable by using a predetermined wet reduction method, a conductive paste obtainable using such a flaky-like silver powder, and a method for producing such a flaky-like silver powder. Disclosed are a flaky-like silver powder obtainable by a wet reduction method, a conductive paste obtainable using a flaky-like silver powder, and a method for producing a flaky-like silver powder, in which the average particle size (D 50 ) as an equivalent circle diameter obtainable when the flaky-like silver powder particles are viewed planarly is adjusted to a value within the range of 1.1 to 30 µm, the thickness of the flaky-like silver powder particles is adjusted to 0.01 to 2 µm, and the bulk density of the flaky-like silver powder is adjusted to a value within the range of 0.1 to 4 g/cm 3 .
机译:提供一种具有低堆积密度以及预定平均粒径(D 50)等的薄片状银粉,其可以通过使用预定的湿还原法获得,并且可以使用这种薄片状获得的导电膏。银粉,以及生产这种片状银粉的方法。本发明公开了通过湿式还原法得到的鳞片状银粉,使用鳞片状银粉可得到的导电膏,以及制造鳞片状银粉的方法,其中平均粒径(D 50)为将鳞片状银粉颗粒的平面观察时获得的当量圆直径调整为1.1至30μm的范围内的值,鳞片状银粉颗粒的厚度调整为0.01至2μm,并且鳞片状银粉的堆积密度调整为0.1〜4g / cm 3的范围内的值。

著录项

  • 公开/公告号EP3015195B1

    专利类型

  • 公开/公告日2018-05-23

    原文格式PDF

  • 申请/专利权人 KAKEN TECH CO LTD;

    申请/专利号EP20140816104

  • 发明设计人 FURUI HIROHIKO;HORI SHIGEO;

    申请日2014-05-27

  • 分类号B22F1/00;B22F1/02;B22F9/24;H01B1/00;H01B1/22;H01B13/00;C09D5/24;H01B1/02;

  • 国家 EP

  • 入库时间 2022-08-21 13:18:24

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