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COPPER-CERAMIC SUBSTRATE, COPPER PRECURSOR FOR PRODUCING A COPPER-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A COPPER-CERAMIC SUBSTRATE
COPPER-CERAMIC SUBSTRATE, COPPER PRECURSOR FOR PRODUCING A COPPER-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A COPPER-CERAMIC SUBSTRATE
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机译:铜陶瓷基体,用于制造铜陶瓷基体的铜前驱体以及用于制造铜陶瓷基体的方法
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摘要
The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.
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