COPPER-CERAMIC SUBSTRATE, COPPER PRECURSOR FOR PRODUCING A COPPER-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A COPPER-CERAMIC SUBSTRATE

摘要

The present invention relates to a copper-ceramic substrate (1) comprising - a ceramic support (2) and - a copper layer (3, 4) joined to a surface of the ceramic support (2), where - the copper layer (3, 4) has at least one first layer (5, 6) which faces the ceramic support and has an averaged first particle size, and a second layer (7, 8) disposed on the side of the copper layer (3, 4) that faces away from the ceramic support (2), and having an averaged second particle size, where - the second particle size is smaller than the first particle size. The first layer (5, 6) has on average a particle size of greater than 100 μm, preferably about 250 to 1000 μm, and - the second layer (7, 8) has on average a particle size of less than 100 μm, preferably about 50 μm, or - the first layer (5, 6) has on average a particle size of greater than 150 pm, preferably about 250 to 2000 μm, and the - second layer (7, 8) has on average a particle size of less than 150 pm, preferably about 50 pm. Preference is given to using Cu-ETP and Cu-OF or Cu-OFE.