MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION DEVICES INCLUDING COMPOUND SEMICONDUCTOR DEVICES INTEGRATED ON AN INTER DIE FABRIC ON PACKAGE

摘要

Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.