An object of the present invention is to start analyzing the cause of a failure within a short period of time after the occurrence of the failure in the market and to reduce the target range of enclosure as small as possible by ensuring a longer period of time to narrow down the target range of products assumed to contain a failure actualization risk of the same type.;In the case where first ID information is received from a semiconductor device with a failure actualized, a semiconductor product quality management server extracts second ID list information containing a failure actualization risk of the same type on the basis of manufacturing history information extracted from a semiconductor manufacturing history information DB using the first ID as a key, and broadcasts the same to an automobile. In the case where a failure is detected, the semiconductor device transmits third ID information stored in a nonvolatile memory to the semiconductor product quality management server. In the case where the second ID list information is received, information related to presence or absence of the failure actualization risk of the same type is output to a driver depending on whether or not the third ID is included in the list information.
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