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SEMICONDUCTOR PRODUCT QUALITY MANAGEMENT SYSTEM, SEMICONDUCTOR PRODUCT QUALITY MANAGEMENT METHOD, AND AUTOMOBILE

机译:半导体产品质量管理系统,半导体产品质量管理方法和汽车

摘要

Analysis of the cause of a failure is started within a short period of time after the occurrence ensuring a longer period of time to narrow down the target range of products assumed to contain a failure actualization risk of the same type. When first ID information is received from a semiconductor device with a failure actualized, second ID list information containing a failure actualization risk of the same type based on manufacturing history information is extracted using the first ID as a key, and is broadcast to an automobile. When a failure is detected, third ID information stored in a nonvolatile memory is transmitted to a semiconductor product quality management server. When the second ID list information is received, information related to the failure actualization risk of the same type is output to a driver depending on whether or not the third ID is included in the list information.
机译:在发生故障后的短时间内就开始进行故障原因分析,以确保更长的时间范围以缩小假定包含相同类型故障实现风险的产品的目标范围。当从发生了故障的半导体装置接收到第一ID信息时,使用第一ID作为密钥,提取基于制造历史信息而包含相同类型的故障实现风险的第二ID列表信息,并广播到汽车。当检测到故障时,将存储在非易失性存储器中的第三ID信息发送到半导体产品质量管理服务器。当接收到第二ID列表信息时,取决于第三ID是否包括在列表信息中,与相同类型的故障实现风险有关的信息被输出给驾驶员。

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