FCBGA SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an FCBGA substrate in which a base is exposed by removal of a part of a surface insulating resin layer (solder resist layer) and can suppress warpage generated at the time of solder reflow without impairing electrical insulation properties in an area immediately below a part on which a semiconductor device in which a conductor land portion of the FCBGA board is removed is mounted.;SOLUTION: An FCBGA substrate 1 includes an FC pad electrode solder-bonded to a terminal electrode array-like arrangement of a semiconductor chip on a surface on which a semiconductor chip 2 is mounted and a solder bonding electrode with a terminal electrode of array-like arrangement of a printed wiring board 6 on the other surface, and a solder resist layer 3 covers the FCBGA substrate except for the FC pad electrode of the FCBGA substrate and the solder bonding electrode on the back side thereof, and a grid-like recess 5 is formed on the surface of the solder resist layer on the FC pad electrode side.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT