INSULATION RELIABILITY EVALUATION CIRCUIT, MANUFACTURING METHOD THEREOF, AND INSULATION RELIABILITY EVALUATION TEST METHOD

摘要

PROBLEM TO BE SOLVED: To provide an insulation reliability evaluation circuit capable of taking an insulation reliability test in an interlayer connection circuit part in a build-up structure of a printed wiring board even with a smaller insulation distance than before and capable of taking a highly accurate and highly reliable insulation evaluation test, a manufacturing method thereof, and an insulation reliability evaluation test method.;SOLUTION: An insulation reliability evaluation circuit includes a substrate 1, a first wiring 4 that can be electrically connected to a plus electrode of a power source and a second wiring 5 that can be electrically connected to a minus electrode of the power source, which are provided on the substrate 1, a first insulating layer 2 provided on the substrate 1, the first wiring 4, and the second wiring 5, a second insulating layer 3 provided on the first insulating layer 2, and a non-penetrating via 6 extending from the second insulating layer 3 to the first wiring 4 or the second wiring 5 through the first insulating layer 2.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT