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METHOD FOR ETCHING NONPOLAR FACE OF NITRIDE-BASED SEMICONDUCTOR, AND METHOD FOR DETECTING CRYSTAL DEFECT IN NONPOLAR FACE OF NITRIDE-BASED SEMICONDUCTOR
METHOD FOR ETCHING NONPOLAR FACE OF NITRIDE-BASED SEMICONDUCTOR, AND METHOD FOR DETECTING CRYSTAL DEFECT IN NONPOLAR FACE OF NITRIDE-BASED SEMICONDUCTOR
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机译:氮化物基半导体非极性表面的刻蚀方法以及氮化物基非极性表面的晶体缺陷检测方法
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摘要
PROBLEM TO BE SOLVED: To detect a crystal defect in a nonpolar face of a nitride-based semiconductor more simply and conveniently.;SOLUTION: A method for etching a nonpolar face of a nitride-based semiconductor SPC comprises the steps of: first, preparing an etchant arranged by adding an additive agent comprising an oxidizing solid to a main agent comprising an alkali metal hydroxide; and subsequently, melting the etchant thus prepared and immersing the nitride-based semiconductor SPC in the molten etchant. Thus, the nonpolar face of the nitride-based semiconductor SPC is etched by chiefly anisotropic chemical etching and as such, etch pits are formed in the nonpolar face of the nitride-based semiconductor SPC, which manifests a crystal defect in the nonpolar face of the nitride-based semiconductor SPC. Therefore, the crystal defect in the nonpolar face of the nitride-based semiconductor SPC can be detected more simply and conveniently.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT
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