ELECTROLESS COPPER PLATING, REMOVAL LIQUID OF CATALYST USED FOR DEPOSITION OF ELECTROLESS COPPER PLATING, AND APPLICATION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide electroless copper plating; and to provide a technology capable of removing in one step, a catalyst used for deposition of electroless copper plating.;SOLUTION: There are provided: electroless copper plating containing an acid and a thiourea compound; a removal liquid of a catalyst used for deposition of electroless copper plating; and a removal method of the catalyst used for electroless copper plating and deposition of electroless copper plating in which a substrate provided with electroless copper plating is treated by the removal liquid.;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT