COPPER COLLOID CATALYST LIQUID FOR ELECTROLESS COPPER PLATING AND ELECTROLESS COPPER PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the temporal stability of a copper catalyst liquid and obtain a copper coating excellent in appearance by subjecting a non-conductive substrate having a catalyst to electroless copper plating.SOLUTION: After immersing a non-conductive substrate in a surfactant containing liquid to perform preliminary adsorption promotion treatment, the temporal stability of the catalyst liquid is remarkably improved by applying a catalyst on the non-conductive substrate using a copper colloid catalyst liquid for electroless copper plating including (A) a soluble copper salt, (B) a reducing agent, (C) a colloid stabilizer and (D) a specified saccharide, such as glucose, malt sugar, xylitol and sorbitol to perform electroless copper plating. Since the catalyst is applied after enhancing catalytic activity to perform electroless plating, the precipitated copper coating is excellent in appearance.SELECTED DRAWING: None