LEAD FRAME, MULTIFACETED BODY OF LEAD FRAME, LEAD FRAME WITH RESIN, MULTIFACETED BODY OF LEAD FRAME WITH RESIN, OPTICAL SEMICONDUCTOR DEVICE, MULTIFACETED BODY OF OPTICAL SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND METHOD OF MANUFACTURING LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame capable of suppressing cracks in a package when an end part of a lead frame is folded.;SOLUTION: A lead frame 10 comprises: first terminal parts 111 and 121 connected with an optical semiconductor element 20; second terminal parts 112 and 122 connected with external equipment; and intermediate parts 113 and 123 provided between the first terminal parts 111 and 121 and the second terminal parts 112 and 122. The intermediate parts 113 and 123 have hole parts 115 and 125 at positions overlapped with folding schedule lines where terminal surfaces of the second terminal parts 112 and 122 are folded to terminal surfaces of the first terminal parts 111 and 121.;SELECTED DRAWING: Figure 3;COPYRIGHT: (C)2018,JPO&INPIT