STRUCTURE AND MANUFACTURING METHOD OF LED MODULE FOR HIGH OUTPUT, HIGH LUMINANCE, HIGH LUMINOUS FLUX ILLUMINATION

摘要

PROBLEM TO BE SOLVED: To provide a structure of LED module and a manufacturing method of module which allow for mounting of an LED element, having face-down structure for flip-chip mounting, on a metal core substrate, bring out reliability of illumination quality and long term durability as an LED module for LED lighting, even with high output, high luminance and high density, and enable high luminous flux.;SOLUTION: For bonding of a pattern electrode formed a metal core substrate and the electrode of a flip-chip LED element, gold particle paste having highest level of electric conductance and thermal conductivity as a material, and capable of adhesion by sintering is used in pin transfer method. Consequently, an LED module excellent in thermal conductivity and heat dissipation, where stress due to temperature or temperature variation is less in an adhesive layer (junction part) or adhesion interface, is obtained, and an LED module having reliability of illumination quality of LED lighting and long term durability, even with high output, high luminance and high density, can be realized.;SELECTED DRAWING: Figure -3;COPYRIGHT: (C)2018,JPO&INPIT