IMAGING ELEMENT UNIT, SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND METHOD FOR SENSING DELAMINATION IN SOLID-STATE IMAGING ELEMENT

摘要

PROBLEM TO BE SOLVED: To increase the manufacturing precision of a solid-state imaging device to increase the reliability of a product.SOLUTION: A sensor unit 13R according to the art hereof comprises: an image sensor 21R; a sensor-attached substrate 22R having the image sensor 21R attached to a substrate surface; and a contact sensor 27 mounted on the substrate surface with the image sensor 21R attached thereto. The contact sensor 27 may be composed of three contact sensors, and they may be mounted around a position where the image sensor 21R is attached.SELECTED DRAWING: Figure 3