High performance thermal conductive surface mount (die attach) adhesive

摘要

A composition comprising (a) 20 to 85 wt% of a thermally conductive silver component containing silver nanoparticles having a particle diameter of 5 to 500 nanometers; (b) a polyorganosilsesquioxane component. (I) 0.5 to 12% by weight of polyorganosilsesquioxane fine powder, (ii) 0.5 to 8% by weight of copolymer powder comprising (I) polyorganosilsesquioxane and ( II) selected from the group consisting of a copolymer powder containing an entangled polymer network with a polydiorganosiloxane, and (iii) 0.5-12% by weight of a combination of polyorganosilsesquioxane fine powder and copolymer powder. A polyorganosilsesquioxane component; and (c) a total solvent content of 3-12% by weight, (i) one or more solvents, (ii) a vehicle containing one or more solvents, Composition comprising the total solvent content, in the form of (iii) a combination thereof.