Laminate, laminate board, multilayer laminate board, printed wiring board, multilayer printed wiring board and method of manufacturing the laminate

摘要

PROBLEM TO BE SOLVED: To provide a laminated plate which solves such a problem that in a laminated plate including a cured resin layer and a glass substrate layer, when a resin composition layer is thick, the glass substrate cannot withstand the thermal expansion force of the resin composition layer and cracks at laminating and cutting; and hardly causes cracks.SOLUTION: In a laminated body including one or more resin composition layers and one or more glass substrate layers, the resin composition layer is formed of a resin composition including a thermosetting resin and an inorganic filler or a resin composition including the thermosetting resin and a fiber base material, and a product d of an average thickness d of the resin composition layer after having been cured, and an average value of a coefficient of thermal expansion at 30-100°C is 1,000 m ppm °Cor less. In a printed wiring board, the laminated plate obtained by heating and molding the laminated body is provided with a circuit.